The ASE CHINA 2023 China International Adhesive and Sealant Exhibition, known as an industry benchmark and reputation, is being held at the Shanghai New International Expo Center. Darbond Technology was invited to participate and made a brilliant appearance at the W5420 booth in W Hall.

The theme of this grand event is "Connecting the World with Adhesive, Smart Adhesive for the Future", showcasing new products, technologies, materials, and solutions to global audiences, achieving upstream and downstream integration of the adhesive industry chain, restarting a new mode of "face-to-face" communication in the industry, bringing together more than 500 domestic and foreign exhibitors. On the first day of the event, it attracted more than 20000 professional visitors.

Darbond showcased its innovative products and leading trends in application fields such as integrated circuits, smart terminals, new energy, and high-end equipment. The products cover a range of electronic packaging materials required for systems ranging from wafer level, chip level, carrier level to smart terminals, automotive electronics, and new energy, attracting top customers, high-quality service providers, media, and terminal enterprises from various industries to observe and exchange ideas.