Darbond® 6331U（Flexible Die attach）

Heating rapid curing

High flexibility, low hardness, low modulus, and excellent high-temperature stability

High adhesion, electrolyte resistance, salt spray resistance

Mainly used in power appliances, such as: MEMS die attach and sealing

Darbond® 6214

Heating rapid curing

Low-expansion coefficient

Excellent temperature cycling resistance

Mainly used for bonding of microchips

Darbond® 6215（Low temperature fast curing）

One-component

Fast curing at lower temperature

Excellent bonding property

Mainly used in smart card chip bonding

Darbond® 6210F（Encapsulating compound）

Single component, medium viscosity

Low curing shrinkage, Anaerobic polymerization inhibition phenomenon.

Excellent sealing and bonding protection for most substrates

Mainly used in packaging fields such as smart card, CSP, BGA, etc.