solutions
Darbond® 6206（Low halogen）
One-component
High adhesion, low water absorption, and good formability
Excellent storage stability
Mainly used for COB bonding
Darbond® 6218（High strength）
High adhesion and low water absorption
Excellent storage stability
Mainly used for adhesive bonding of CCD/CMOS frames in camera modules
Darbond® 6219（High strength）
High adhesion and low water absorption
Excellent storage stability
Mainly used for adhesive bonding of CCD/CMOS frames in camera modules
Darbond® 6220（Universal type）
One-component
Low temperature rapid curing
Excellent adhesion and flexibility
Mainly used for temperature sensitive components bonding
Darbond® 6222（Universal type）
One-component
Low temperature rapid curing
Excellent adhesion and flexibility
Mainly used for temperature sensitive components bonding
Darbond®6222H（High viscosity）
Single component, high viscosity
Low temperature rapid curing
Excellent adhesion and flexibility
Mainly used for temperature sensitive components bonding
Darbond® 6225（Low precipitation）
High bonding strength, good toughness and good drop resistance after curing
Mainly used in camera module CCD/CMOS and temperature sensitive components bonding
Darbond® 6228（High reliability）
One-component
Good adhesion, good resistance to moisture and heat, good flexibility, fluorescent recognition
Mainly used in magnetic core bonding
Darbond® 6230（UV Thermosetting）
High adhesion, high toughness, high reliability
Excellent storage stability
Mainly used for the assembly and bonding of components in the AA process of camera module
Darbond® 6234（UV Thermosetting）
High adhesion, high toughness, high reliability
Plasma independent, no plasma surface treatment required
Mainly used for the assembly and bonding of components in the AA process of camera module
Darbond® 6242（Low temperature fast curing）
Low temperature curing
Good adhesion, good resistance to moisture and heat, good flexibility, fluorescent recognition
Mainly used for magnetic circuit bonding
Darbond® 6461HF（Low halogen）
Single component, low halogen content
Application range -40~180℃
Good adhesive strength and temperature resistance
Mainly used for bonding and sealing of components such as transformers and inductors
Darbond® 6462（High-performance）
Good adhesion, sealing, and flexibility
Medium temperature rapid curing
No corrosion or pollution to the substrate, and no pollution to the environment
Mainly used in structural bonding and sealing protection
Darbond® 6655（Low halogen）
Single component, low halogen content
Low temperature rapid curing
High thixotropy, compatible with lead-free reflux
Mainly used for bottom reinforcement after assembly of BGA, CSP and other products