Products and industry
solutions
solutions
Features
Darbond® 6568（Chip-level）
Single component, high viscosity
170℃ fast curing, repairable, good toughness, high and low temperature resistance
Mainly used for filling protection of inverted chip
Darbond® 6563（Chip-level）
Single component, low viscosity
170℃ fast curing, repairable
Mainly used for filling protection of inverted chip
Product parameters
Product number